Resistance change memory

ABSTRACT

According to one embodiment, a memory includes memory cells between first conductive lines and second conductive lines. A control circuit is configured to apply a first potential to a first end of a selected first conductive line connected to the selected memory cell among the first conductive lines and first ends of unselected second conductive lines not connected to the selected memory cell among the second conductive lines, apply a second potential larger than the first potential to a first end of a selected second conductive line connected to the selected memory cell among the second conductive lines, apply third potentials smaller than the second potential to first ends of unselected first conductive lines not connected to the selected memory cell among the first conductive lines respectively, and change values of the third potentials based on an address of the selected first conductive line.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/822,009, filed May 10, 2013, the entire contents of which areincorporated herein by reference.

FIELD

Embodiments described herein relate generally to a resistance changememory.

BACKGROUND

A memory cell array of a resistance change memory having a cross-pointtype has been considered. For example, the cross-point type is an arraystructure comprising first conductive lines (e.g., word lines), secondconductive lines (e.g., bit lines), and memory cells arranged betweenthese lines.

In an operation mode that a voltage or a current is applied to oneselected memory cell, leak currents may flow through many otherunselected memory cells in some cases. When a sum of the leak currentsturns to a sneak current, the voltage or the current applied to theselected memory cell is reduced.

Therefore, to apply the voltage or the current which changes resistanceto the selected memory cell, an operation voltage becomes large, and aconsumption current is thereby increased.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an example of a system block of a resistance change memoryaccording to a comparative example;

FIG. 2 is an example of a view showing a memory cell array in FIG. 1;

FIG. 3 is an example of a view showing a connecting relationship betweena resistance change element and a rectifying element;

FIG. 4 is an example of a view showing a bias relationship in anoperation mode that a current is allowed to flow through a selectedmemory cell;

FIG. 5 is an example of a view showing a relationship between a positionof a selected memory cell and a voltage drop;

FIG. 6 is an example of a view showing a resistance change memory thatrealizes a first technological concept;

FIG. 7 is an example of a view showing a bias relationship in anoperation mode that a current is allowed to flow through a selectedmemory cell;

FIG. 8 is an example of a view showing an example of potentials appliedto unselected first conductive lines;

FIG. 9 is an example showing a relationship between an address of aselected memory cell and potentials in the unselected first conductivelines;

FIG. 10 is an example of a view showing an example of potentials appliedto unselected first conductive lines;

FIG. 11 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected firstconductive lines;

FIG. 12 is an example of a view showing an example of potentials appliedto unselected first conductive lines;

FIG. 13 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected firstconductive lines;

FIG. 14 is an example of a view showing an example of potentials appliedto unselected first conductive lines;

FIG. 15 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected firstconductive lines;

FIG. 16 is an example of a view showing a bias relationship in anoperation mode that a current is allowed to flow through a selectedmemory cell;

FIG. 17 is an example of a view showing relationship between a positionof a selected memory cell and a voltage drop;

FIG. 18 is an example of a view showing a resistance change memory thatrealizes a second technological concept;

FIG. 19 is an example of a view showing an example of potentials appliedto unselected second conductive lines;

FIG. 20 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected secondconductive lines;

FIG. 21 is an example of a view showing an example of potentials appliedto unselected second conductive lines;

FIG. 22 is an example of a view showing an address of a selected memorycell and potentials in unselected second conductive lines;

FIG. 23 is an example of a view showing an example of potentials appliedto unselected second conductive lines;

FIG. 24 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected secondconductive lines;

FIG. 25 is an example of a view showing an example of potentials appliedto unselected second conductive lines;

FIG. 26 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected secondconductive lines;

FIG. 27 is an example of a view showing an example of potentials appliedto unselected second conducive lines;

FIG. 28 is an example of a view showing a relationship between anaddress of a selected memory cell and potentials in unselected secondconductive lines;

FIGS. 29 to 32 are examples of a view showing adjusted values ofunselected first/second conductive lines associated with a position of aselected memory cell;

FIG. 33 is an example of a view showing a resistance change memoryaccording to an application example; and

FIG. 34 is am example of a view showing a memory cell array in FIG. 33.

DETAILED DESCRIPTION

In general, according to one embodiment, a resistance change memorycomprises: first conductive layers extending in a first direction, andarranged in a second direction intersect with the first direction;second conductive layers extending in the second direction, and arrangedin the first direction; memory cells between the first conductive linesand the second conductive lines; a first driver/decoder connected tofirst ends of the first conductive lines; a second driver/decoderconnected to first ends of the second conductive lines; a potentialgenerating circuit generating a potential which is applied to the firstends of the first conductive lines and the first ends of the secondconductive lines; and a control circuit controlling a operation modewhich applies a voltage or a current to a selected memory cell among thememory cells. Each of the memory cells comprises a rectifying elementand a resistance change element connected in series. The control circuitis configured, in the operation mode, to: apply a first potential to afirst end of a selected first conductive line connected to the selectedmemory cell among the first conductive lines and first ends ofunselected second conductive lines not connected to the selected memorycell among the second conductive lines, apply a second potential largerthan the first potential to a first end of a selected second conductiveline connected to the selected memory cell among the second conductivelines, apply third potentials smaller than the second potential to firstends of unselected first conductive lines not connected to the selectedmemory cell among the first conductive lines respectively, and changevalues of the third potentials based on an address of the selected firstconductive line.

Embodiments will now be described hereinafter with reference to thedrawings.

1. RESISTANCE CHANGE MEMORY (1) Comparative Example

FIG. 1 shows an example of a system block of a resistance change memoryaccording to a comparative example. FIG. 2 shows an example of a memorycell array.

A memory cell array 11 is of a cross-point type. That is, memory cellsMC are arranged between first conductive lines La1, . . . La2, La3, andLa4 that are extended in a first direction and aligned in a seconddirection and second conductive lines Lb1, . . . Lb2, Lb3, and Lb4 thatare extended in the second direction and aligned in the first direction.

In this example, to simplify the explanation, the number of the firstconductive lines La1, . . . La2, La3, and La4 or the second conductivelines Lb1, . . . Lb2, Lb3, and Lb4 is four, but the present invention isnot restricted thereto.

Each memory cell MC comprises a resistance change element 12 and arectifying element 13 that are connected in series.

The resistance change element 12 is an element that can electricallyswitch two or more resistance values which are different from eachother. For example; in case of storing two values (1 bit) in theresistance change element 12, a resistance value in the resistancechange element 12 is changed in two patterns (a low-resistance state/ahigh-resistance state).

The resistance change element 12 comprises a resistance change materialwhose resistance value varies depending on a voltage or a current. Asthe resistance change material, there are metal oxides, e.g., an Aloxide, an Hf oxide, a Ti oxide, and an La oxide, or a mixture of thesematerials.

An initial state of the resistance change element 12 is, e.g., ahigh-resistance state. This is an example, and the initial state of theresistance change element 12 may be set to a low-resistance state. Ingeneral, an operation for changing the resistance value in theresistance change element 12 from the high-resistance state to thelow-resistance state is called a set operation. The set operation isperformed by, e.g., applying a set voltage to the resistance changeelement 12.

Further, in general, an operation for changing the resistance value inthe resistance change element 12 from the low-resistance state to thehigh-resistance state is called a reset operation. The reset operationis performed by, e.g., applying a reset voltage to the resistance changeelement 12 and allowing a reset current to flow through the resistancechange element 12.

The rectifying element 13 is, e.g., a diode. It is to be noted that therectifying element 13 may be unnecessary in some cases.

When the resistance change element 12 is of a unipolar type, therectifying element 13 is, e.g., a PIN diode. Furthermore, when theresistance change element 12 is of a bipolar type, the rectifyingelement 13 may be, e.g., an MIM diode.

For example, as shown in FIG. 3, as a connecting relationship betweenthe resistance change element 12 and the rectifying element 13, thereare two patterns, i.e., a case (No. 1) where the resistance changeelement 12 is provided on a second conductive line Lbj side and therectifying element 13 is provided on a first conductive line Lai sideand a case (No. 2) where the resistance change element 12 is provided onthe first conductive line Lai side and the rectifying element 13 isprovided on the second conductive line Lbj side.

A first decoder/driver 14 a is connected to one end of each of the firstconductive lines La1, . . . La2, La3, and La4. The first decoder/driver14 a comprises a selection transistor SELa and an inverter DRa as adriver. ON/OFF of the selection transistor SELa is controlled byselection signals φa1, φa2, φa3, and φa4 obtained by decoding addresssignals.

A second decoder/driver 14 b is connected to one end of each of thesecond conductive lines Lb1, . . . Lb2, Lb3, and Lb4. The seconddecoder/driver 14 b comprises a selection transistor SELb and aninverter DRb as a driver. ON/OFF of the selection transistor SELb iscontrolled by selection signals φb1, φb2, φb3, and φb4 obtained bydecoding address signals.

A potential generating circuit 15 generates potentials Va1, . . . Va2,Va3, and Va4 applied to one end of each of the conductive lines La1, . .. La2, La3, and La4 and potentials Vb1, . . . Vb2, Vb3, an Vb4 appliedto one end of each of the second conductive lines Lb1, . . . Lb2, Lb3,and Lb4.

In this example, these potentials Va1, . . . Va2, Va3, Va4, Vb1, . . .Vb2, Vb3, and Vb4 are defined by “H” or “L”. “H” represents a high-levelpotential and means, e.g., a power supply potential Vdd. Further, “L”represents a low-level potential and means, e.g., a ground potentialVss.

Address signals are input to first and second decoders/drivers 14 a and14 b through an address buffer 16. The first and second decoders/drivers14 a and 14 b generate selection signals φa1, φa2, φa3, φa4, φb1, φb2,φb3, and φb4 based on the address signals.

A control circuit 17 determines values of the potentials Va1, . . . Va2,Va3, and Va4 applied to one end of each of the first conductive linesLa1, . . . La2, La3, and La4 and values of the potentials Vb1, . . .Vb2, Vb3, and Vb4 applied to one end of each of the second conductivelines Lb1, . . . Lb2, Lb3, and Lb4 in a write operation (set/reset)operation and a read operation, and supplies these values to thepotential generating circuit 15.

(2) Bias Relationship in Comparative Example

FIG. 4 shows a bias relationship in a comparative example.

A selected memory cell M-sel which is a target of the write (set/reset)operation or the read operation is connected between the firstconductive line La4 and the second conductive line Lb4.

In this case, the potential Va4 applied to one end of the selected firstconductive line La4 is set to V_(L) (e.g., the ground potential Vss),and the potential Vb4 applied to one end of the selected secondconductive line Lb4 is set to V_(H) (e.g., the power supply potentialVdd).

Therefore, a forward bias is applied to a diode in the selected memorycell M-sel, and a current Ipass flows through a resistance changeelement in the selected memory cell M-sel.

Further, to avoid erroneously writing data into unselected memory cellsexcluding the selected memory cell M-sel, the potentials Va1, . . . Va2,and Va3 applied to one end of each of the unselected first conductivelines La1, . . . La2, and La3 are set to V_(H) (e.g., the power-supplypotential Vdd), and the potentials Vb1, . . . Vb2, and Vb3 applied toone end of each of the unselected second conductive lines Lb1, . . .Lb2, and Lb3 are set to V_(L) (e.g., the ground potential Vss).

Therefore, the bias is not applied to the unselected memory cellsconnected to the selected first conductive line La4 (potentials at bothends of each unselected memory cell are both V_(L)), and hence erroneouswriting is avoided.

Likewise, the bias is not applied to the unselected memory cellsconnected to the selected second conductive line Lb4 (potentials at bothends of each unselected memory cell are both V_(H)), and hence erroneouswriting is avoided.

A bias relationship is collectively shown in Table 1.

TABLE 1 Write/Read (Set/Reset) of M-sel La1 V_(H) Lb1 V_(L) La2 V_(H)Lb2 V_(L) La3 V_(H) Lb3 V_(L) La4 V_(L) Lb4 V_(H)

However, a backward bias is applied to the diode in each of theunselected memory cells (memory cells in a hatched region) connectedbetween the unselected first conductive lines La1, . . . La2, and La3and the unselected second conductive lines Lb1, . . . Lb2, and LB3. As aresult, a leak current Ileak flows in each of these unselected memorycells. Although a value of each of the leak currents Ileak is verysmall, but the number of the unselected memory cells in which the leakcurrents Ileak become huge, and hence a sum may be a considerable valuein some cases.

This sum turns to a so-called sneak current and increases a consumptioncurrent. Therefore, in an operation mode that a voltage or a current isapplied to the selected memory cell M-sel, it is preferable to suppressthe sneak current and efficiently apply a predetermined voltage orcurrent to the selected memory cell M-sel.

(3) Focus Point

Attention is turned to a voltage drop in each of the selected firstconductive line and the selected second conductive line to which theselected memory cell is connected.

First, the voltage drop in the selected second conductive line will bedescribed.

FIG. 5 shows an example of a simulation result of the voltage drop inthe selected second conductive line Lbj to which the selected memorycell M-sel is connected.

In this example, to simplify the explanation, a potential applied to oneend of the selected second conductive line Lbj is assumed to be 8 V.

Furthermore, addresses mean addresses (e.g., row addresses) of the firstconductive lines La1, . . . La4000. In this examples, the addresses arerepresented as 1 to 4000, but the present invention is not restrictedthereto. The number of the addresses may be above or below thesenumbers.

Moreover, the addresses are assumed to sequentially increase from theinverter DRb side that drives the second conductive lines toward itsopposite side.

This simulation enables verifying how the voltage drop in the selectedsecond conductive line Lbj varies in accordance with its position(corresponding to the address of each first conductive line) based on awiring resistance of the selected second conductive line Lbj.

As shown on the lower side in FIG. 5, a potential in the selected secondconductive line Lbj substantially linearly (linear-functionally) lowersfrom one end of the driver DRb side of the selected second conductiveline Lbj toward a position (an address) of the selected memory cellM-sel.

For example, when the address of the selected memory cell M-sel is 1000(corresponding to Near), the potential in the selected second conductiveline Lbj gradually lowers from the address 1 toward the address 1000,and it becomes approximately 7.5 V at the address 1000 corresponding tothe position of the first conductive line La1000. In this case, thevoltage drop in the second conductive line Lbj is hardly observed at theaddress 1001 corresponding to a position of the first conductive lineLa1001 and subsequent addresses.

Additionally, for example, when the address of the selected memory cellM-sel is 2000 (corresponding to Middle), the potential in the selectedsecond conductive line Lbj gradually lowers from the address 1 towardthe address 2000, and it becomes approximately 7 V at the address 2000corresponding to a position of the first conductive line La2000. In thiscase, the voltage drop in the second conductive line Lbj is hardlyobserved at the address 2001 corresponding to a position of the firstconductive line La2001 and subsequent addresses.

Further, for example, when the address of the selected memory cell M-selcorresponding to the position of the first conductive line La3000 is3000 (corresponding to Far), the potential in the selected secondconductive line Lbj gradually lowers from the address 1 toward theaddress 3000, and it becomes approximately 6.5 V at the address 3000. Inthis case, the voltage drop in the second conductive line Lbj is hardlyobserved at the address 3001 corresponding to a position of the firstconductive line La3001 and subsequent addresses.

The voltage drops are collectively shown in Table 2.

TABLE 2 Voltage drop of Lb4 Node Voltage N1 V_(H) − α1 N2 V_(H) − α2 N3V_(H) − α3 N4 V_(H  )  

However, Lb4 in Table 2 corresponds to the second conductive line Lb4 inFIGS. 4, and N1 to N4 in Table 2 correspond to nodes N1 to N4 of thesecond conductive line Lb4 in FIG. 4. It is to be noted that a selectedfirst wiring line is the first conductive line La4. Furthermore, V_(H)in Table 2 is a potential (e.g., 8 V) applied to one end of the secondconductive line Lb4 in FIG. 4, and α1<α2<α3 is achieved.

Therefore, focusing attention on the voltage drop in the selected secondconductive line Lbj, it can be understood that the potentials in theunselected first conductive lines do not have to be uniformed to a fixedpotential V_(H), e.g., the power supply potential Vdd and they can beadjusted in accordance with, e.g., a position of the selected memorycell, namely, the address of the selected first conductive line.

Furthermore, the potentials in the unselected first conductive lines arereadjusted in accordance with the address of the selected memory cellM-sel. As a result, the leak currents in the unselected memory cells canbe reduced, the sneak current can be suppressed, and the consumptioncurrent can be decreased.

This point will now be described hereinafter.

However, in the following description, to simplify the explanation, itis assumed that the voltage drop in the selected second conductive lineLbj can be approximated from one end of the selected second conductiveline Lbj on the driver DRb side to the position (the address) of theselected memory cell M-sel by using a linear function.

It is to be noted that, in reality, the voltage drop in the selectedsecond conductive line Lbj may be intricately changed due to theposition of the selected memory cell M-sel (which is the address of theselected second conducive, line Lbj in particular), an influence fromthe unselected first conductive lines (capacitance coupling), and thelike.

That is, it may be desirable to approximate the voltage drop in theselected second conductive line Lbj from one end of the selected secondconductive line Lbj on the driver DRb side to the position (the address)of the selected memory cell M-sel by using a quadratic function, a cubicfunction, or an nth-order function (n is a natural number equal to orhigher than 2) in some cases.

2. FIRST TECHNOLOGICAL CONCEPT

FIG. 6 shows an example of a system block of a resistance change memorythat realizes the first technological concept. FIG. 7 shows an exampleof a memory cell array.

In these drawings, like reference numerals denote elements equal tothose in FIG. 1 and FIG. 2, thereby omitting a detailed descriptionthereof. Moreover, like FIG. 4, it is assumed that a selected memorycell M-sel is connected between the first conductive line La4 and thesecond conductive line Lb4.

Structural characteristics of this resistance change memory lie in that:an address signal indicative of a position (an address) of the selectedmemory cell M-sel (an address signal that designates the selected firstconductive line La4) is input to the control circuit 17; any one of thepotentials Va1, . . . Va2, and Va3 applied to one end of each of theunselected first conductive lines La1, . . . La2, and La3 output fromthe potential generating circuit 15 is adjusted in accordance with theaddress of the selected memory cell M-sel; and adjustment values of thepotentials Va1, Va2, and Va3 applied to one end of each of theunselected first conductive lines La1, . . . La2, and La3 are determinedbased on an LUT (Look up table) in a memory portion 18.

Further, the first decoder/driver 14 a does not have to have theinverter DRa in FIG. 4 in order to apply each of the potentials Va1, . .. Va2, and Va3 adjusted in accordance with the address of the selectedmemory cell M-sel to one end of each of the unselected first conductivelines La1, . . . La2, and La3. In this case, each of the potentials Va1,. . . Va2, Va3, and Va4 is applied to one end of each of the unselectedfirst conductive lines La1, . . . La2, La3, and La4 through theselection transistor SELa.

In the first technological concept, at the time of performing the writeoperation or the read operation with respect to the selected memory cellM-sel, a potential applied to one end of each of the unselected firstconductive lines La1, . . . La2, and La3 is adjusted based on theaddress signal that designates the selected memory cell M-sel (theaddress signal that designates the selected first conductive line La4).

For example, the potential Val applied to one end of the unselectedfirst conductive line La1 is set to (V_(H)-α1), the potential Va2applied to one end of the unselected first conductive line La2 is set to(V_(H)-α2), and the potential Va3 applied to one end of the unselectedfirst conductive line La3 is set to (V_(H)-α3).

However, α1, α2, and α3 are offset values from the conventional valueV_(H) (e.g., the power supply potential Vdd).

Furthermore, assuming that the voltage drop in the selected secondconductive line Lb4 can be approximated from one end of the selectedsecond conductive line Lb4 on the driver DRb side to the position of theselected memory cell M-sel by using a linear function, the offset valuesα1, α2, and α3 have a relationship of α1<α2<α3.

Moreover, when the voltage drop in the selected second conductive lineLb4 is approximated by using a quadratic function, a cubic function, annth-order function, or the like, the offset values α1, α2, and α3 mayhave a relationship other than α1<α2<α3, e.g., α1<α2>α3 or α1>α2>α3 insome cases.

On the other hand, the potential Va4 applied to one end of the selectedfirst conductive line La4 is set to V_(L) (e.g., the ground potentialVss) like the comparative example, and the potential Vb4 applied to oneend of the selected second conductive line Lb4 is also set toe V_(H)(e.g., the power supply potential Vdd) like the comparative example.

Therefore, a forward bias is applied to the diode in the selected memorycell M-sel, and the current Ipass flows through the resistance changeelement in the selected memory cells M-sel.

Additionally, the potentials Vb1, . . . Vb2, and Vb3 applied to one endof each of the unselected second conductive lines Lb1, . . . Lb2, andLb3 are also set to V_(L) (e.g., the ground potential Vss).

Therefore, since the bias is not applied to the unselected memory cellsconnected to the selected first conductive line La4 (potentials at bothends of each unselected memory cell are both V_(L)), erroneous writingis avoided.

Likewise, since the bias is not applied to the unselected memory cellsconnected to the selected second conductive line Lb4, erroneous writingis avoided.

Specifically, a potential in the unselected first conductive line La1and a potential in the node N1 of the selected second conductive lineLb4 are both (V_(H)−α1), a potential in the unselected first conductiveline La2 and a potential in the node N2 of the selected secondconductive line Lb4 are both (V_(H)−α2), and a potential in theunselected first conductive line La3 and a potential in the node N3 ofthe selected second conductive line Lb4 are both (V_(H)−α3).

The bias relationship is collectively shown in Table 3.

TABLE 3 Write/Read (Set/Reset) of M-sel La1 V_(H) − α1 Lb1 V_(L) La2V_(H) − α2 Lb2 V_(L) La3 V_(H) − α3 Lb3 V_(L) La4 V_(L )    Lb4 V_(H)

As described above, according to the first technological concept, whenattention is turned to the voltage drop in the selected secondconductive line Lb4, the potentials Va1, . . . Va2, and Va3 applied toone end of each of the unselected first conductive lines

La1, . . . La2, and La3 can be reduced to be smaller than theconventional value V_(H) (e.g., the power supply potential Vdd).

As a result, in the unselected memory cells connected between theunselected first conductive lines La1, . . . La2, and La3 and theunselected second conductive lines Lb1, . . . Lb2, and Lb3 (the memorycells in the hatched region), a backward bias applied to each diodebecomes smaller than that in the conventional example.

Therefore, the leak currents Ileak generated in the unselected memorycells also become small.

As described above, when the potentials in the unselected firstconductive lines La1, . . . La2, and La3 are adjusted in accordance withthe address of the selected memory cell M-sel, the leak currents in theunselected memory cells can be reduced, the sneak current can besuppressed, and a consumption current can be decreased.

3. EMBODIMENTS OF FIRST TECHNOLOGICAL CONCEPT (1) First Embodiments

FIG. 8 shows a first embodiment which is an example of determiningpotentials in unselected first conductive lines.

In this example, the high potential V_(H) is applied to one end of theselected second conductive line Lbj, and the low potential V_(L) isapplied to one end of the selected first conductive line and one end ofeach of the unselected second conductive lines. Moreover, a position (anaddress) of the selected first conductive line, i.e., a position (anaddress) of the selected memory cell M-sel sequentially varies, and anadjustment value of the potential applied to one end of each of theunselected first conductive lines is determined in accordance with thisposition.

In this example, addresses of the first conductive lines La1, . . .La4000 (e.g., row addresses) are represented as 1 to 4000, respectively,but the present invention is not restricted thereto. The number of thefirst conductive lines (the number of the addresses) may be equal to orhigher than or may be equal to or lower than these values.

Further, the addresses of the first conductive lines La1, . . . La4000are assumed to gradually increase from the inverter DRb side that drivesthe second conductive lines toward the opposite side thereof.

Additionally, in this example, the position of the selected firstconductive line, i.e., the position of the selected memory cell M-sel isclassified into three types, i.e., an address 1000 (La1000: Near), anaddress 2000 (La2000: Middle), and an address 3000 (La3000: Far), andthese addresses will be explained.

In this example, the control circuit 17 adjusts the potential applied toone end of each of the unselected conductive lines placed on theinverter (the driver) DRb side of the selected memory cell M-sel inaccordance with each first conductive line.

For example, when the address of the selected memory cell M-sel is 1000(Near), each of the potentials Va1, . . . Va999 applied to one end ofeach of the unselected first conductive lines La1, . . . La999 placed onthe inverter DRb side of the selected memory cell M-sel is set to eachof V_(H)−α1, V_(H)−α999. However, each of α1, . . . α999 is a differencefrom the high potential V_(H) (e.g., the power supply potential Vdd).Here, α1, . . . α999 are called offset values.

The offset values α1, . . . α999 can be determined in accordance witheach first conductive line La.

For example, assuming that the voltage drop in the selected secondconductive line Lbj can be approximated from one end of the inverter DRbside to the position of the selected memory cell M-sel by using thelinear function as shown in the drawing, there is a relationship theoffset value α1< . . . <the offset value α999.

When the address of the selected memory cell M-sel is 2000 (Middle),there is a relationship of the offset value α1< . . . <the offset valueα1999. Further, likewise, when the address of the selected memory cellM-sel is 3000 (Far), there is a relationship of the offset value α1< . .. <the offset value a2999.

It is to be noted that it may be desirable to approximate the adjustmentvalue (the offset value) of the potential applied to one end of each ofthe unselected first conductive lines placed on the inverter DRb side ofthe selected memory cell M-sel by using the quadratic function, thecubic function, or an nth-order function (n is a natural number equal toor higher than 2) in some situations. In such cases, the control circuit17 individually determines the adjustment value (the offset value) ofthe potential in each of the unselected first conductive line inaccordance with such a function.

This will be described later.

Then, the potential applied to one end of each of the unselected firstconductive lines placed on the opposite side of the inverter (thedriver) DRb side of the selected memory cell M-sel is set.

The potential applied to one end of each of the unselected firstconductive lines (Far unselected first conductive lines) havingaddresses higher than that of the selected memory cell M-sel can bedetermined by using each adjustment value. For example, it can be saidthat the potential applied to one end of each of the Far unselectedfirst conductive lines can be changed in accordance with the address ofthe selected memory cell M-sel. However, the potentials applied to theends of the Far unselected first conductive lines on one side can beuniformed (the same potential).

That is because, as shown in the lower views of FIG. 8, the voltage dropin the second conductive line Lbj whose address is smaller than theselected memory cell M-sel is considerable, whereas the voltage drop inthe second conductive line Lbj whose address is larger than that of theselected memory cell M-sel is nearly nothing. Thus, the control circuit17 determines the voltage in each Far unselected first conductive lineby using an adjustment value a of the selected first conductive line.

For example, when the address of the selected memory cell M-sel is 1000(Near), the control circuit 17 sets potentials Va1001, . . . Va4000applied to one end of each of the Far unselected first conductive linesLa1001, . . . La4000 to a voltage VUX, e.g., the same value asV_(H)−α1000 (a potential at an intermediate point of the selected secondconductive line Lbj at the position of the selected memory cell M-sel).

Furthermore, likewise, when the address of the selected memory cellM-sel is 2000 (Middle), the control circuit 17 sets potentials Va2001, .. . Va4000 applied to one end of each of the Far unselected firstconductive lines La2001, . . . La4000 to the voltage VUX, e.g.,V_(H)−α2000 (the potential at the intermediate point of the selectedsecond conductive line Lbj at the position of the selected memory cellM-sel). Moreover, likewise, when the address of the selected memory cellM-sel is 3000 (Far), the control circuit 17 sets potentials Va3001, . .. Va4000 applied to one end of each of the Far unselected firstconductive lines La3001, . . . La4000 to the voltage VUX, e.g.,V_(H)−α3000 (the potential at the intermediate point of the selectedsecond conductive line Lbj at the position of the selected memory cellM-sel). However, the voltage VUX is not restricted to V_(H)−α1000,V_(H)−α2000, and V_(H)−α3000, and other values may be adopted.

Thus, the relationship between the address of the selected memory cellM-sel, voltages of the potentials in the unselected first conductivelines, and the adjustment values (the DRb side and the opposite side) iscollectively shown in FIG. 9. An example of a table shown in FIG. 9 isstored as, e.g., the LUT in the memory portion 18 depicted in FIG. 6.

According to the first example, since the adjustment value of thepotential applied to one end of each of the unselected first conductivelines is determined in accordance with the position (the address) of theselected first conductive line, i.e., the position (the address) of theselected memory cell M-sel, each leak current (the sneak current) in thecross-point type memory cell array can be suppressed, and alow-consumption current can be achieved.

(2) Second Embodiment

FIG. 10 shows a second embodiment that determines potentials inunselected first conductive lines.

The second embodiment is a modification of the first embodiment.

As compared with the first embodiment, this example is characterized inhow to determine a potential that is applied to one end of each ofunselected first conductive lines (Far unselected first conductivelines) placed on the opposite side of an inverter (a driver) DRb side ofa selected memory cell M-sel. Other points are the same as those in thefirst embodiment, thereby omitting a detailed description thereof.

In this example, the first conductive lines are classified into blocks.

For example, the first conductive lines La1, . . . La1000 havingaddresses 1 to 1000 are classified into a first block B1, the firstconductive lines La1001, . . . La2000 having addresses 1001 to 2000 areclassified into a second block B2, the first conductive lines La2001, .. . La3000 having addresses 2001 to 3000 are classified into a thirdblock B3, and the first conductive lines La3001, . . . La4000 havingaddresses 3001 to 4000 are classified into a fourth block B4.

Further, the control circuit 17 sets an adjustment value of a potentialapplied to one end of each of Far unselected first conductive lines to acommon value (the same potential) in a block to which an address of theselected memory cell M-sel, i.e., an address of a selected firstconductive line belongs.

For example, when the address of the selected memory cell M-sel fallswithin the range of 1 to 1000, which is the address 1000 (Near) in thisexample, the address of the selected memory cell M-sel belongs to thefirst block B1.

In this case, the selection control circuit 17 constantly sets each ofpotentials Va1001, . . . Va4000 applied to one end of each of the Farunselected first conductive lines La1001, . . . La4000 to a voltage VUX1(Fixed), for example, to V_(H)−αUX1 while fixing an adjustment value toαUX1 irrespective of the address (1 to 1000) of the selected memory cellM-sel.

It is to be noted that a value of V_(H)−αUX1 can be set to, e, g., oneof V_(H)−α1, . . . V_(H)−α1000.

Further, when the address of the selected memory cell M-sel falls withinthe range of 1001 to 2000, which is the address 2000 (Middle) in thisexample, the address of the selected memory cell M-sel belongs to thesecond block B2.

In this case, the control circuit 17 constantly sets each of potentialsVa2001, . . . Va4000 applied to one end of each of the Far unselectedfirst conductive lines La2001, . . . La4000 to a voltage VUX2 (Fixed),for example, to V_(H)−αUX2 while fixing an adjustment value to αUX2irrespective of the address (1001 to 2000) regardless of the selectedmemory cell M-sel.

It is to be noted that a value of V_(H)−αUX2 can be set to, e, g., oneof V_(H)−α1001, V_(H)−α2000.

Thereafter, the control circuit 17 likewise configures the setting whenthe address of the selected memory cell M-sel falls within the range of2001 to 3000 and the range of 3001 to 4000.

Thus, the relationship between the address of the selected memory cellM-sel, the potentials in the unselected first conductive lines, and theadjustment values (the DRb side and the opposite side thereof) iscollectively shown in FIG. 11. A table shown in FIG. 11 is stored as,e.g., the LUT in a memory portion 18 depicted in FIG. 6.

According to the second embodiment, since the adjustment value of thepotential applied to one end of each of the unselected first conductivelines is determined in accordance with the position (the address) of theselected first conductive line, i.e., the position (the address) of theselected memory cell M-sel, each leak current (the sneak current) in thecross-point type memory cell array can be suppressed, and alow-consumption current can be achieved.

Additionally, when the Far unselected first conductive lines have thesame value in a fixed range, operation parameters can be reduced. As aresult, the operation can be simplified.

(3) Third Embodiment

FIG. 12 shows a third embodiment that determines potentials inunselected first conductive lines.

The third embodiment is a modification of the second embodiment.

As compared with the second embodiment, this example is characterized inhow to determine an adjustment value of a potential that is applied toone end of each of unselected first conductive lines (Near unselectedfirst conductive lines) placed on an inverter (a driver) DRb side of aselected memory cell M-sel. Other points are the same as those in thesecond embodiment, thereby omitting a detailed description thereof.

In this example, the first conductive lines are likewise classified intoblocks. Since a classification method is the same as that in the secondembodiment, a description thereof will be omitted here.

The control circuit 17 sets an adjustment value of a potential appliedto one end of each of Near unselected first conductive lines to a commonvalue (the same potential) in a block to which an address of a selectedmemory cell M-sel, i.e., an address of a selected first conductive linebelongs.

For example, when the address of the selected memory cell M-sel fallswithin the range of 1 to 1000, which is the address 1000 (Near) in thisexample, the address of the selected memory cell M-sel belongs to thefirst block B1.

In this case, the control circuit 17 constantly sets each of potentialsVa1, . . . Va999 applied to one end of each of the Near unselected firstconductive lines La1, . . . La999 to a voltage VUX1a (Fixed), forexample, to V_(H)−αUX1a while fixing an adjustment value to αUX1airrespective of the address (1 to 1000) of the selected memory cellM-sel.

It is to be noted that a value of V_(H)−αUX1a can be set to, e, g., oneof V_(H)−α1, . . . V_(H)−α1000.

Like the second embodiment, the control circuit 17 constantly sets eachof potentials Va1001, . . . Va4000 applied to one end of each of the Farunselected first conductive lines La1001, . . . La4000 to a voltage VUX2(Fixed), for example, to V_(H)−αUX1b while fixing an adjustment value toaUXlb irrespective of the address (1 to 1000) of the selected memorycell M-sel.

Furthermore, when the address of the selected memory cell M-sel fallswithin the range of 1001 to 2000, which is the address 1000 (Middle) inthis example, the address of the selected memory cell M-sel belongs tothe second block B2.

In this case, the selection control circuit 17 constantly sets each ofpotentials Va1, . . . Va1999 applied to one end of each of the Nearunselected first conductive lines La1, . . . La1999 to a voltage VUX2a(Fixed), for example, to V_(H)−αUX2a while fixing an adjustment value toαUX2a irrespective of the address (1001 to 2000) of the selected memorycell M-sel.

It is to be noted that a value of V_(H)−αUX2a can be set to, e, g., oneof V_(H)−α1001, . . . V_(H)−α2000.

Each of potentials Va2001, . . . Va4000 applied to one end of each ofthe Far unselected first conductive lines La2001, . . . La4000 is set toan adjustment value VUX2b (Fixed), for example, to V_(H)−αUX2birrespective of the address (1001 to 2000) of the selected memory cellM-sel.

Thereafter, the control circuit 17 likewise configures the setting whenthe address of the selected memory cell M-sel falls within the range of2001 to 3000 and the range of 3001 to 4000. Thus, the relationshipbetween the address of the selected memory cell M-sel and the adjustmentvalues of the potentials in the unselected first conductive lines (theDRb side and the opposite side thereof) is collectively shown in FIG.13. A table shown in FIG. 13 is stored as, e.g., the LUT in the memoryportion 18 depicted in FIG. 6.

Furthermore, in FIG. 13, VUX1a and VUX1b may have the same value or mayhave different values. This can be likewise applied to: VUX2a and VUX2b;VUX3a and VUX3b; and VUX4a and VUX4b.

According to the third embodiment, since the potential applied to oneend of each of the unselected first conductive lines and the adjustmentvalue are determined in accordance with the position (the address) ofthe selected first conductive line, i.e., the position (the address) ofthe selected memory cell M-sel, each leak current (the sneak current) inthe cross-point type memory cell array can be suppressed, and alow-consumption current can be attained.

Moreover, when the unselected conductive lines closer to the inverterDRb side are simply allowed to have the same value, operation parameterscan be reduced. As a result, the operation can be simplified. Voltagesof the Far unselected first conductive lines can be the same as those inthe first embodiment.

(4) Fourth Embodiment

FIG. 14 shows a fourth embodiment that determines potentials inunselected first conductive lines.

The fourth embodiment is a modification of the third embodiment.

As compared with the third embodiment, this example is characterized inhow to determine a potential (an adjustment value) applied to one end ofeach of unselected first conductive lines (Near unselected firstconductive lines) placed on an inverter (a driver) DRb side of aselected memory cell M-sel. Other points are the same as those in thethird embodiment, and hence a detailed description thereof will beomitted.

In this example, an adjustment value of a potential applied to one endof each of the Near unselected first conductive lines is determined inaccordance with each block. That is, although the potentials (theadjustment values) applied to ends of the unselected first conductivelines on one side in the same block are the same, the potentials (theadjustment values) applied to ends of the unselected first conductivelines on one side in different blocks are different from each other.

For example, when an address of the selected memory cell M-sel is in therange of 1 to 1000, which is an address 1000 (Near) in this example, theaddress of the selected memory cell M-sel belongs to a first block B1.

In this case, the Near unselected first conductive lines La1, . . .La999 all belong to the first block B1.

Therefore, a control circuit 17 constantly sets potentials Va1, . . .Va999 applied to one end of each of the Near unselected first conductivelines La1, . . . La999 to a voltage VUX1a (Fixed) irrespective of theaddress (1 to 1000) of the selected memory cell M-sel.

Additionally, when the address of the selected memory cell M-sel is inthe range of 1001 to 2000, which is an address 2000 (Middle) in thisexample, the address of the selected memory cell M-sel belongs to asecond block B2.

In this case, of the Near unselected first conductive lines La1, . . .La1999, the first conductive lines La1, . . . La1000 belong to the firstblock B1, and the first conductive lines La1001, . . . La1999 belong tothe second block B2.

Therefore, the control circuit 17 constantly sets the potentials Va1, .. . Va1000 applied to one end of each of the first conductive lines La,. . . La1000 in the first block B1 in the Near unselected firstconductive lines La1, . . . La1999 to the voltage VUX1a (Fixed)irrespective of the address (1001 to 2000) of the selected memory cellM-sel.

Further, the control circuit 17 constantly sets the potentials Va1001, .. . Va1999 applied to one end of each of the first conductive linesLa1001, . . . La1999 in the second block B2 in the Near unselected firstconductive lines La1, . . . La1999 to a voltage VUX2a (Fixed)irrespective of the address (1001 to 2000) of the selected memory cellM-sel.

Thereafter, the control circuit 17 likewise configures the setting whenthe address of the selected memory cell M-sel falls within the range of2001 to 3000 and the range of 3001 to 4000. It is to be noted that thecontrol circuit 17 sets voltages (adjustment values) of the Farunselected first conductive lines to be equal to those in the thirdembodiment. Furthermore, the control circuit 17 can set the voltages(the adjustment values) of the Far unselected first conductive lines tobe equal to those in the second or first embodiment.

Thus, the relationship between the address of the selected memory cellM-sel and the adjustment values of the potentials in the unselectedfirst conductive lines (the DRb side and the opposite side thereof) iscollectively shown in FIG. 15. A table shown in FIG. 15 is stored as anLUT in, e.g., the memory portion 18 in FIG. 6.

According to the fourth embodiment, since the potential (the adjustmentvalue) applied to one end of each of the unselected first conductivelines is determined in accordance with the position (the address) of theselected first conductive line, i.e., the position (the address) of theselected memory cell M-sel, each leak current (a sneak current) in thecross-point type memory cell array can be suppressed, and alow-consumption current can be attained.

Moreover, in each of the unselected conductive lines close to theinverter DRb side, an optimum value differs depending on a potentialdrop. However, in case of adjusting voltages with respect to all thefirst conductive lines, an operation becomes complicated, and a circuitarea increases. Therefore, the unselected first conductive lines closeto the inverter DRb side are divided into fixed ranges (blocks), andthese lines are set to the same adjustment value in accordance with eachblock, thereby reducing operation parameters. As a result, the operationcan be simplified.

4. SECOND TECHNOLOGICAL CONCEPT

The first technological concept is characterized in that attention isturned to a voltage drop of a selected second conductive line to which ahigh potential V_(H) is applied at one end thereof and each potentialapplied to one end of each of unselected first conductive lines ischanged in accordance with a position (an address) of the selectedmemory cell.

On the other hand, the second technological concept is characterized inthat attention is turned to a voltage drop of a selected firstconductive line to which a low potential V_(L) is applied at one endthereof (a voltage drop from an intermediate point of the selected firstconductive line (a position to which a selected memory cell isconnected) to one end of the first conductive line) and each potentialapplied to one end of each of unselected second conductive lines ischanged in accordance with a position of the selected memory cell, i.e.,a position (an address) of the selected second conductive line.

FIG. 18 shows a resistance change memory that realizes the secondtechnological concept.

In this drawing, like reference numerals denote elements equal to thosein FIG. 6 and FIG. 7, thereby omitting a detailed description thereof.

Structural characteristics of this resistance change memory lie in thatan address signal indicative of a position (an address) of a selectedmemory cell M-sel (an address signal that designates a selected secondconductive line Lb4) is input to a control circuit 17, potentials Vb1, .. . Vb2, and Vab which are output from a potential generating circuit 15and applied to one end of each of unselected second conductive linesLb1, . . . Lb2, and Lb3 are set to voltages associated with the addressof the selected memory cell M-sel, and adjustment values of thepotentials Vb1, Vb2, and Vb3 applied to one end of each of theunselected second conductive lines Lb1, . . . Lb2, and Lb3 aredetermined based on an LUT (Look up table) in a memory portion 18.

Additionally, since each of the potentials Vb1, Vb2, and Vb3 set to theadjustment values in accordance with the address of the selected memorycell M-sel is applied to one end of each of the unselected secondconductive lines Lb1, . . . Lb2, and Lb3, an inverter DRb in a seconddecoder/driver 14 b can be omitted. That is, the control circuit 17 canapply each of the potentials Vb1, . . . Vb2, Vb3, and Vb4 to one end ofeach of the unselected second conductive lines Lb1, . . . Lb2, Lb3, andLb4 through a selection transistor SELb.

In the second technological concept, at the time of executing a writeoperation or a read operation with respect to the selected memory cellM-sel, a potential applied to one end of each of the unselected secondconductive lines Lb1, . . . Lb2, and Lb3 is set to an adjustment valuebased on an address signal that designates the selected memory cellM-sel (an address signal that designates the selected second conductiveline Lb4). Voltage drops are collectively shown in Table 4.

TABLE 4 Voltage drop of La4 Node Voltage N5 V_(L) + α5 N6 V_(L) + α6 N7V_(L) + α7 N8 V_(L) + α8

However, La4 in Table 4 corresponds to the first conductive line La4 inFIG. 18, N5 to N8 in Table 4 correspond to nodes N5 to N8 of the firstconductive line La4. Further, V_(L) in Table 4 represents a potential(e.g., 0 V) applied to one end of the first conductive line La4. Here,α5, α6, and α7 are set values (offset values) from a conventional valueV_(L) (e.g., a ground potential Vss). Furthermore, assuming that thevoltage drop in the selected second conductive line La4 can beapproximated from one end of the selected first conductive line La4 onthe driver DRa side to the position of the selected memory cell M-sel byusing a linear function, the offset values α5, α6, and α7 have arelationship of α5<α6<α7.

Therefore, paying attention to a voltage drop in a selected firstconductive line Lai, potentials in unselected second conductive lines donot have to be uniformed to a fixed potential V_(L), e.g., the groundpotential Vss, and a voltage or an adjustment value can be changed inaccordance with, e.g., a position of the selected memory cell M-sel,i.e., an address of the selected second conductive line.

Further, when potentials in the unselected second conductive lines arechanged to adjustment values in accordance with an address of theselected memory cell M-sel, each leak current in the unselected memorycells can be reduced, a sneak current can be suppressed, and a reductionin consumption current can be achieved.

It is to be noted that the voltage drop in the selected first conductiveline Lai is intricately changed due to the position of the selectedmemory cell M-sel (which is the address of the selected first conduciveline Lai in particular), an influence from the unselected secondconductive lines (capacitance coupling), and the like.

That is, it may be preferable to approximate the voltage drop in theselected first conductive line Lai from one end of the selected firstconductive line Lai on the driver DRa side to the position (the address)of the selected memory cell M-sel by using a quadratic function, a cubicfunction, or an nth-order function (n is a natural number equal to orhigher than 2) in some cases.

For example, the potential Vb1 applied to one end of the unselectedsecond conductive line Lb1 is set to (V_(L)+α5), the potential Vb2applied to one end of the unselected second conductive line Lb2 is setto (V_(L)+α6), and the potential Vb3 applied to one end of the selectedsecond conductive line Lb3 is set to (V_(L)+α7).

On the other hand, the potential Va4 applied to one end of the selectedfirst conductive line La4 is set to V_(L) (e.g., a ground potentialVss), and the potential Vb4 applied to one end of the selected secondconductive line Lb4 is set to V_(H) (e.g., a power supply potentialVdd).

Therefore, a forward bias is applied to a diode in the selected memorycell M-sel, and a predetermined current Ipass flows through theresistance change element in the selected memory cell M-sel.

Further, the potentials Va1, . . . Va2, and Va3 applied to one end ofeach of the unselected first conductive lines La1, . . . La2, and La3are set to V_(H) (e.g., the power supply potential Vdd).

Therefore, since the bias is not applied to the unselected memory cellsconnected to the selected second conductive line Lb4 (potentials at bothends of each unselected memory cell are both V_(H)), erroneous writingis avoided.

Likewise, since the bias is not applied to the unselected memory cellsconnected to the selected first conductive line La4, erroneous writingis avoided.

Specifically, a potential in the unselected second conductive line Lb1and a potential in the node N5 of the selected first conductive line La4are both (V_(L)−α5), a potential in the unselected second conductiveline Lb2 and a potential in the node N6 of the selected first conductiveline La4 are both (V_(L)−α6), and a potential in the unselected secondconductive line Lb3 and a potential in the node N7 of the selected firstconductive line La4 are both (V_(L)−α7).

The bias relationship is collectively shown in Table 5.

TABLE 5 Write/Read (Set/Reset) of M-sel La1 V_(H) Lb1 V_(L) + α5 La2V_(H) Lb2 V_(L) + α6 La3 V_(H) Lb3 V_(L) + α7 La4 V_(L) Lb4 V_(H )  

As described above, according to the second technological concept, whenattention is turned to the voltage drop in the selected first conductiveline La4, the potentials Vb1, . . . Vb2, and Vb3 applied to one end ofeach of the unselected second conductive lines Lb1, Lb2, and Lb3 can beincreased to be higher than the conventional value V_(L) (e.g., theground potential Vss).

As a result, in the unselected memory cells connected between theunselected first conductive lines La1, . . . La2, and La3 and theunselected second conductive lines Lb1, . . . Lb2, and Lb3 (the memorycells in the hatched region), a backward bias applied to each diodebecomes smaller than that in the conventional example.

Therefore, the leak currents Ileak generated in the unselected memorycells also become small.

As described above, when the potentials (the adjustment values) in theunselected second conductive lines Lb1, . . . Lb2, and Lb3 are changedin accordance with the address of the selected memory cell M-sel, theleak currents in the unselected memory cells can be reduced, the sneakcurrent can be suppressed, and a consumption current can be decreased.

5. EMBODIMENTS OF SECOND TECHNOLOGICAL CONCEPT (1) First Embodiment

FIG. 19 and FIG. 20 show a first embodiment that determines potentialsin unselected second conductive lines.

In this example, a high potential V_(H) is applied to one end of aselected second conductive line and one end of each of unselected firstconductive lines, and a low potential VL is applied to one end of theselected first conductive line Lai. Furthermore, a potential (anadjustment value) applied to one end of each of unselected secondconductive lines is determined in accordance with a position (anaddress) of the selected second conductive line, i.e., a position (anaddress) of the selected memory cell M-sel.

In this example, addresses of the second conductive lines Lb1, . . .Lb4000 (e.g., column addresses) are represented as 1 to 4000,respectively, but the present invention is not restricted thereto. Thenumber of the second conductive lines (the number of the addresses) maybe equal to or higher than or may be equal to or lower than thesevalues.

Furthermore, the addresses of the second conductive lines Lb1, . . .Lb4000 are assumed to sequentially increase from the inverter DRa sidethat drives the first conductive lines toward the opposite side thereof.

Additionally, in this example, the position of the selected secondconductive line, i.e., the position of the selected memory cell M-sel isclassified into three types, i.e., an address 1000 (Lb1000: Near), anaddress 2000 (Lb2000: Middle), and an address 3000 (Lb3000: Far), andthese addresses will be explained.

In this example, first, a potential (an adjustment value) applied to oneend of each of the unselected second conductive lines placed on theinverter (the driver) DRa side of the selected memory cell M-sel is setin accordance with each second conductive line.

For example, when the address of the selected memory cell M-sel is 1000(Near), each of the potentials Vb1, . . . Vb999 applied to one end ofeach of the unselected second conductive lines Lb1, . . . Lb999 (Nearunselected second conductive lines) placed on the inverter DRa side ofthe selected memory cell M-sel is set to each of V_(L)−α1, V_(L)−α999.However, each of α1, . . . α999 is an adjustment value (an offset value)from a low potential V_(L) (e.g., the ground potential Vss).

The adjustment values α1, . . . α999 can be independently determined inaccordance with each second conductive line.

For example, assuming that the voltage drop in the selected firstconductive line Lai can be approximated from the position of theselected memory cell M-sel to one end of the inverter DRa side by usingthe linear function as shown in the drawing, there is a relationship ofα1< . . . <α999.

Moreover, when the address of the selected memory cell M-sel is 2000(Middle), the control circuit 17 sets each of the potentials Vb1, . . .Vb1999 applied to one end of each of the Near unselected secondconductive lines Lb1, . . . Lb1999 to each of V_(L)−α1, . . .V_(L)−α1999. However, each of α1, . . . α1999 is an adjustment valuefrom the low potential V_(L) (e.g., the ground potential Vss).

The offset values α1, . . . α1999 can be independently determined inaccordance with each second conductive line.

For example, assuming that the voltage drop in the selected firstconductive line Lai can be approximated from the position of theselected memory cell M-sel to one end of the inverter DRb side by usingthe linear function as shown in the drawing, there is a relationship ofα1< . . . <α1999.

Additionally, when the address of the selected memory cell M-sel is 3000(Far), the control circuit 17 sets each of the potentials Vb1, . . .Vb2999 applied to one end of each of the Near unselected secondconductive lines Lb1, . . . Lb2999 to each of V_(L)−α1, V_(L)−α2999.However, each of α1, . . . α2999 is an adjustment value from the lowpotential V_(L) (e.g., the ground potential Vss).

The adjustment values α1, . . . α1999 can be independently determined inaccordance with each second conductive line.

For example, assuming that the voltage drop in the selected firstconductive line Lai can be approximated from the position of theselected memory cell M-sel to one end of the inverter DRb side by usingthe linear function as shown in the drawing, there is a relationship ofα1< . . . <α2999.

Then, a potential (an adjustment value) applied to one end of each ofthe unselected second conductive lines (the Far unselected secondconductive lines) placed on the opposite side of the inverter (thedriver) DRa side of the selected memory cell M-sel is set.

Although the potential applied to one end of each of the Far unselectedsecond conductive lines is changed in accordance with the address of theselected memory cell M-sel, it is common (the same potential) in theseunselected second conductive lines.

That is because, as shown in FIG. 19, the voltage drop in the selectedfirst conductive line Lai is large on the inverter DRa side of theselected memory cell M-sel but the voltage drop in the selected firstconductive line Lai is hardly observed on the opposite side of theinverter DRa side of the selected memory cell M-sel.

For example, when the address of the selected memory cell M-sel is 1000(Near), the control circuit 17 sets each of the potentials Vb1001, . . .Vb4000 applied to one end of the unselected second conductive linesLb1001, . . . Lb4000 placed on the opposite side of the inverter DRaside of the selected memory cell M-sel to a voltage VUX1, e.g.,V_(L)+α1000 (a potential at an intermediate point of the selected firstconductive line Lai at the position of the selected memory cell M-sel).However, the voltage VUX1 is not restricted to V_(L)+α1000, and anyother value may be adopted.

Furthermore, when the address of the selected memory cell M-sel is 2000(Middle), each of the potentials Vb2001, . . . Vb4000 applied to one endof each of the Far unselected second conductive lines Lb2001, . . .Lb4000 is set to a voltage VUX1, e.g., V_(L)+α2000 (a potential at anintermediate point of the selected first conductive line Lai at theposition of the selected memory cell M-sel). However, the voltage VUX1is not restricted to V_(L)+α2000, and any other value may be adopted.

Moreover, when the address of the selected memory cell M-sel is 3000(Far), each of the potentials Vb3001, . . . Vb4000 applied to one end ofeach of the Far unselected second conductive lines Lb3001, . . . Lb4000is set to a voltage VUX1, e.g., V_(L)+α3000 (a potential at anintermediate point of the selected first conductive line Lai at theposition of the selected memory cell M-sel). However, the voltage VUX1is not restricted to V_(L)+α3000, and any other value may be adopted.

According to the first embodiment, since the voltage (the adjustmentvalue) of the potential applied to one end of each of the unselectedsecond conductive lines is determined in accordance with the position(the address) of the selected second conductive line, i.e., the position(the address) of the selected memory cell M-sel, the leak currents (thesneak current) in the cross-point type memory cell array can besuppressed, and a low-consumption current can be attained.

(2) Second Embodiment

FIG. 21 and FIG. 22 show a second embodiment that determines potentialsin unselected second conductive lines.

The second embodiment is a modification of the first embodiment.

As compared with the first embodiment, this example is characterized inhow to determine a potential (an adjustment value) that is applied toone end of each of unselected second conductive lines (Far unselectedsecond conductive lines) placed on the opposite side of an inverter (adriver) DRa side of a selected memory cell M-sel. Other points are thesame as those in the first embodiment, thereby omitting a detaileddescription thereof.

In this example, the second conductive lines are classified into blocks.

For example, the second conductive lines Lb1, . . . Lb1000 havingaddresses 1 to 1000 are classified into a first block B1, the secondconductive lines Lb1001, . . . Lb2000 having addresses 1001 to 2000 areclassified into a second block B2, the second conductive lines Lb2001, .. . Lb3000 having addresses 2001 to 3000 are classified into a thirdblock B3, and the second conductive lines Lb3001, . . . Lb4000 havingaddresses 3001 to 4000 are classified into a fourth block B4.

Further, an adjustment value of a potential applied to one end of eachof Far unselected second conductive lines to a common value (the samepotential) in a block to which an address of the selected memory cellM-sel, i.e., an address of a selected second conductive line belongs.

For example, when the address of the selected memory cell M-sel fallswithin the range of 1 to 1000, which is the address 1000 (Near) in thisexample, the address of the selected memory cell M-sel belongs to thefirst block B1.

In this case, the control circuit 17 constantly sets each of potentialsVb1001, . . . Vb4000 applied to one end of each of the Far unselectedsecond conductive lines Lb1001, . . . Lb4000 to a voltage VUX1 (Fixed),for example, V_(HL)αUX1 irrespective of the address (1 to 1000) of theselected memory cell M-sel.

It is to be noted that a value of V_(L)−αUX1 can be set to, e, g., oneof V_(L)−α1, V_(L)−α1000.

Further, when the address of the selected memory cell M-sel falls withinthe range of 1001 to 2000, which is the address 2000 (Middle) in thisexample, the address of the selected memory cell M-sel belongs to thesecond block B2.

In this case, each of potentials Vb2001, . . . Vb4000 applied to one endof each of the Far unselected second conductive lines Lb2001, . . .Lb4000 is constantly set to a voltage VUX2 (Fixed), for example,V_(L)−αUX2 irrespective of the address (1001 to 2000) of the selectedmemory cell M-sel.

It is to be noted that a value of V_(L)−αUX2 can be set to, e, g., oneof V_(L)−α1001, V_(L)−α2000. Thereafter, the control circuit 17 likewiseconfigures the setting when the address of the selected memory cellM-sel falls within the range of 2001 to 3000 and the range of 3001 to4000.

Thus, the relationship between the address of the selected memory cellM-sel and the potentials (the adjustment values) in the unselectedsecond conductive lines (the DRa side and the opposite side thereof) iscollectively shown in FIG. 22. A table shown in FIG. 22 is stored as,e.g., an LUT in a memory portion 18 depicted in FIG. 18.

According to the second embodiment, since the potential (the adjustmentvalue) applied to one end of each of the unselected second conductivelines is determined in accordance with the position (the address) of theselected first conductive line, i.e., the position (the address) of theselected memory cell M-sel, each leak current (the sneak current) in thecross-point type memory cell array can be suppressed, and alow-consumption current can be achieved.

(3) Third Embodiment

FIG. 23 and FIG. 24 show a third embodiment that determines potentialsin unselected second conductive lines.

The third embodiment is a modification of the second embodiment.

As compared with the second embodiment, this example is characterized inhow to determine a potential (an adjustment value) that is applied toone end of each of unselected second conductive lines (Far unselectedsecond conductive lines) placed on an inverter (a driver) DRa side of aselected memory cell M-sel. Other points are the same as those in thesecond embodiment, thereby omitting a detailed description thereof.

In this example, the second conductive lines are likewise classifiedinto blocks. Since a classification method is the same as that in thesecond embodiment, a description thereof will be omitted here.

A potential (an adjustment value) applied to one end of each ofunselected second conductive lines placed on the inverter DRa side ofthe selected memory cell M-sel is set a common value (the samepotential) in a block to which an address of the selected memory cellM-sel, i.e., an address of a selected second conductive line belongs.

For example, when the address of the selected memory cell M-sel fallswithin the range of 1 to 1000, which is the address 1000 (Near) in thisexample, the address of the selected memory cell M-sel belongs to thefirst block B1.

In this case, each of potentials Vb1, . . . Vb999 applied to one end ofeach of the Near unselected second conductive lines Lb1, . . . Lb999 isconstantly set to a voltage VUX1a (Fixed), for example, to V_(L)−αUX1airrespective of the address (1 to 1000) of the selected memory cellM-sel.

It is to be noted that a value of V_(L)−αUX1a can be set to, e, g., oneof V_(L)−α1, V_(L)−α1000.

Like the second embodiment, each of potentials Vb1001, . . . Vb4000applied to one end of each of the unselected second conductive linesLb1001, . . . Lb4000 placed on the opposite side of the inverter DRaside of the selected memory cell M-sel is constantly set to a voltageVUX1b (Fixed), for example, to V_(L)−αUX1b irrespective of the address(1 to 1000) irrespective of the address (1 to 1000) of the selectedmemory cell M-sel.

Furthermore, when the address of the selected memory cell M-sel fallswithin the range of 1001 to 2000, which is the address 1000 (Middle) inthis example, the address of the selected memory cell M-sel belongs tothe second block B2.

In this case, each of potentials Vb1, . . . Vb1999 applied to one end ofeach of the Near unselected second conductive lines Lb1, . . . Lb1999 isconstantly set to an adjustment value VUX2a (Fixed), for example, toV_(L)−αUX2a irrespective of the address (1001 to 2000) of the selectedmemory cell M-sel.

It is to be noted that a value of V_(L)−αUX2a can be set to, e, g., oneof V_(L)−α1001, V_(L)−α2000.

Each of potentials Vb2001, . . . Vb4000 applied to one end of each ofthe Far unselected first conductive lines Lb2001, . . . Lb4000 is set toan adjustment value VUX2b (Fixed), for example, to V_(L)−αUX2birrespective of the address (1001 to 2000) of the selected memory cellM-sel. Furthermore, as the voltage applied to one end of each of the Farunselected second conductive lines, the control circuit 17 can adopt thesame voltage in the first embodiment.

Moreover, the same setting is configured when the address of theselected memory cell M-sel falls within the range of 2001 to 3000 andthe range of 3001 to 4000.

Thus, the relationship between the address of the selected memory cellM-sel and the adjustment values of the potentials in the unselectedsecond conductive lines (the DRa side and the opposite side thereof) iscollectively shown in FIG. 24. A table shown in FIG. 24 is stored as,e.g., the LUT in the memory portion 18 depicted in FIG. 18.

Furthermore, in FIG. 24, VUX1a and VUX1b may have the same value or mayhave different values. This can be likewise applied to: VUX2a and VUX2b;VUX3a and VUX3b; and VUX4a and VUX4b.

According to the third embodiment, since the potential (the adjustmentvalue) applied to one end of each of the unselected second conductivelines is determined in accordance with the position (the address) of theselected second conductive line, i.e., the position (the address) of theselected memory cell M-sel, each leak current (the sneak current) in thecross-point type memory cell array can be suppressed, and alow-consumption current can be attained.

(4) Fourth Embodiment

FIG. 25 and FIG. 26 show a fourth embodiment that determines potentialsin unselected second conductive lines.

The fourth embodiment is a modification of the third embodiment.

As compared with the third embodiment, this example is characterized inhow to determine an adjustment value of a potential applied to one endof each of unselected second conductive lines (Near unselected secondconductive lines) placed on an inverter (a driver) DRa side of aselected memory cell M-sel. Other points are the same as those in thethird embodiment, and hence a detailed description thereof will beomitted.

In this example, a potential (an adjustment value) applied to one end ofeach of the Near unselected second conductive lines is determined inaccordance with each block. That is, although the adjustment values ofthe potentials applied to ends of the unselected second conductive lineson one side in the same block are the same, the adjustment values of thepotentials applied to ends of the unselected second conductive lines onone side in different blocks are different from each other.

For example, when an address of the selected memory cell M-sel is in therange of 1 to 1000, which is an address 1000 (Near) in this example, theaddress of the selected memory cell M-sel belongs to a first block B1.

In this case, the unselected second conductive lines Lb1, . . . Lb999placed on the inverter DRa side of the selected memory cell M-sel allbelong to the first block B1.

Therefore, the control circuit 17 constantly sets potentials Vb1, . . .Vb999 applied to one end of each of the Near unselected secondconductive lines Lb1, . . . Lb999 to a voltage VUX1a (Fixed)irrespective of the address (1 to 1000) of the selected memory cellM-sel.

Additionally, when the address of the selected memory cell M-sel is inthe range of 1001 to 2000, which is an address 2000 (Middle) in thisexample, the address of the selected memory cell M-sel belongs to asecond block B2.

In this case, of the Near unselected second conductive lines Lb1, . . .Lb1999, the second conductive lines Lb1, . . . Lb1000 belong to thefirst block B1, and the second conductive lines Lb1001, . . . Lb1999belong to the second block B2.

Therefore, the control circuit 17 constantly sets the potentials Vb1, .. . Vb1000 applied to one end of each of the first conductive lines Lb1,. . . Lb1000 in the first block B1 in the Near unselected secondconductive lines Lb1, . . . Lb1999 to the voltage VUX1a (Fixed)irrespective of the address (1001 to 2000) of the selected memory cellM-sel.

Further, the control circuit 17 constantly sets the potentials Vb1001, .. . Vb1999 applied to one end of each of the second conductive linesLb1001, . . . Lb1999 in the second block B2 in the Near unselectedsecond conductive lines Lb1, . . . Lb1999 to a voltage VUX2a (Fixed)irrespective of the address (1001 to 2000) of the selected memory cellM-sel.

Further, the same setting is configured when the address of the selectedmemory cell M-sel falls within the range of 2001 to 3000 and the rangeof 3001 to 4000.

Thus, the relationship between the address of the selected memory cellM-sel and the adjustment values of the potentials in the unselectedsecond conductive lines (the DRa side and the opposite side thereof) iscollectively shown in FIG. 26. A table shown in FIG. 26 is stored as anLUT in, e.g., a memory portion. It is to be noted that the controlcircuit 17 sets voltages (adjustment values) of the Far unselected firstconductive lines to be equal to those in the third embodiment.Furthermore, the control circuit 17 can set the voltages (the adjustmentvalues) of the Far unselected first conductive lines to be equal tothose in the second or first embodiment.

According to the fourth embodiment, since the potential (the adjustmentvalue) applied to one end of each of the unselected second conductivelines is determined in accordance with the position (the address) of theselected second conductive line, i.e., the position (the address) of theselected memory cell M-sel, each leak current (a sneak current) in thecross-point type memory cell array can be suppressed, and alow-consumption current can be attained.

5. COMBINATION OF FIRST AND SECOND TECHNOLOGICAL CONCEPTS

The first and second technological concepts can be combined.

That is, a potential applied to one end of each of unselected firstconductive lines and a potential applied to one end of each ofunselected second conductive lines can be adjusted in accordance with aposition (an address) of a selected memory cell, respectively.

In this case, since each leak current in the cross-point type memorycell array can be more finely controlled in accordance with a positionof the selected memory cell, a voltage can be efficiently applied to theselected memory cell, thereby realizing a lower-consumption current.

6. HOW TO DETERMINE ADJUSTMENT VALUE (OFFSET VALUE)

A description will now be given as to how to determine an optimum valueof a potential for each of unselected first conductive lines in thefirst technological concept and how to determine an optimum value of apotential for each of unselected second conductive lines in the secondtechnological concept.

These adjustment values vary depending on characteristics of each memorycell (a resistance change element and a rectifying element), a size of amemory cell array (wiring resistances of the first and second conductivelines), or a parasitic capacitance generated in the first and secondconductive lines.

Therefore, when these elements are determined as prerequisites, theoptimum values can be normalized, and their adjustment values can beapplied to the first to fourth embodiments in the first and secondtechnological concepts.

FIG. 29 shows each optimum value normalized in accordance with aposition of a selected memory cell.

An ordinate in FIG. 29 represents a voltage applied to the selectedmemory cell. Here, a situation where the voltage applied to the selectedmemory cell becomes the maximum is normalized as 1. An abscissarepresents a voltage value of each of unselected first conductive lines(the first technological concept) or each of unselected secondconductive lines (the second technological concept). Here, theunselected first conductive lines (the first technological concept) andthe unselected second conductive lines (the second technologicalconcept) will be generically referred to as unselected conductive lines.

A dot ♦ indicated as Near corresponds to a case where the selectedmemory cell is assumed to have an address 1000.

A dot ▪ indicated as Middle corresponds to a case where the selectedmemory cell is assumed to have an address 2000.

A dot ▴ indicated as Far corresponds to a case where the selected memorycell is assumed to have an address 3000.

Here, as shown in FIG. 29, when a voltage of each unselected conductiveline is changed, a voltage applied to the selected memory cell varies.Here, each unselected conductive line with which the voltage applied toa selected conductive line becomes the highest is determined tocorrespond to an adjustment value. In addition, it can be understoodthat unevenness occurs due to a parasitic capacitance of each unselectedconductive line or the like. Therefore, it is preferable to obtain anadjustment value by performing fitting with respect to each plot.

Therefore, like the first embodiment in each of the first and secondtechnological concepts, it is desirable to set a voltage (an adjustmentvalue) in accordance with each unselected first conductive line or eachunselected second conductive line.

Furthermore, in case of applying the result shown in FIG. 29 to, e.g.,the third embodiment in each of the first and second technologicalconcepts, “VUX1a and VUX1b”, “VUX2a and VUX2b”, and “VUX3a and VUX3b” inFIG. 13 and FIG. 24 can be determined as follows, respectively.

When a voltage calculated from an average of adjustment values in asituation where a position of a selected memory cell corresponds to Nearis determined as VUX-near-ave, both VUX1a and VUX1b in FIG. 13 and FIG.24 can be set to VUX-near-ave. Moreover, when a voltage calculated froman average of adjustment values in a situation where a position of theselected memory cell corresponds to Middle is determined asVUX-middle-ave, both VUX2a and VUX2b in FIG. 13 and FIG. 24 can be setto VUX-middle-ave. Additionally, when a voltage calculated from anaverage of adjustment values in a situation where a position of theselected memory cell corresponds to Far is determined is determined asVUX-far-ave, both VUX3a and VUX3b in FIG. 13 and FIG. 24 can be set toVUX-far-ave.

The example of FIG. 29 has a relationship ofVUX-near-ave<VUX-middle-ave<VUX-far-ave.

FIG. 30 to FIG. 32 show a relationship between an address of theselected memory cell and each adjustment value. In each of FIG. 30 toFIG. 32, an ordinate represents an adjustment value of a selectedconductive line in FIG. 29, and an abscissa represents an address of theselected conductive line.

In the drawings, an address of the selected memory cell means an addressof the selected first conductive line in the first technologicalconcept, and it means an address of the selected second conductive linein the second technological concept.

Further, adjustment value means an average of adjustment values ofpotentials in unselected first conductive lines (the first technologicalconcept) or an average of adjustment values of potentials in unselectedsecond conductive lines (the second technological concept).

For example, in regard to an address 1000, VUX-near-ave explained inFIG. 29 corresponds to a voltage calculated from the adjustment valuedescribed herein. In regard to an address 2000, VUX-middle-ave explainedin FIG. 29 corresponds to a voltage calculated from the adjustment valuedescribed herein. In regard to an address 3000, VUX-far-ave explained inFIG. 29 corresponds to a calculated voltage described herein.

In the example shown in FIG. 30, a relationship between the address andthe adjustment value is fitted by using a linear function. In theexample shown in FIG. 31, the relationship between the address and theadjustment value is fitted by using a quadratic function. In the exampleshown in FIG. 32, the relationship between the address and theadjustment value is fitted by using a cubic function.

This adjustment value (an offset value) is acquired by, e.g., asimulation at the time of designing the resistance change memory or adie sort test of a trial product. Furthermore, the relationship betweenthe address and the adjustment value is represented in the form of atable, and it is previously stored in, e.g., the memory portion (e.g.,an ROM) 18 in FIG. 6 before product shipment.

In this example, the relationship between the address and the adjustmentvalue is approximated by using an nth-order function, e.g., the linearfunction, the quadratic function, or the cubic function, but theactually obtained adjustment value itself may be stored in the memoryportion like the first embodiment in each of the first and secondtechnological concepts.

Moreover, at the time of an actual operation (a write/read operation),the control circuit reads an adjustment value of a potential applied toone end of each of unselected first or second conductive lines from thememory portion 18 in FIG. 6 based on an address of a selected memorycell. Additionally, the potential generating circuit 15 shown in FIG. 6is used to actually generate these adjustment values, and each of theseadjustment values is applied to one end of each of the unselected firstor second conductive lines.

As described above, the adjustment values of the potentials of theunselected first conductive lines in the first technological concept andthe adjustment values of the potentials in the unselected secondconductive lines in the second technological concept are determined, andthe adjustment values are used at the time of an actual operation,thereby achieving low-consumption power at the time of the actualoperation.

7. APPLICATION EXAMPLE

The resistance change memory according to each of the first and secondtechnological concepts can be applied to, e.g., a three-dimensionalcross-point type resistance change memory.

Each of FIG. 33 and FIG. 34 shows a three-dimensional cross-point typeresistance change memory.

A memory cell array 11, first and second decoders/drivers 14 a and 14 b,a potential generating circuit 15, an address buffer 16, a controlcircuit 17, and a memory portion 18 are arranged on a semiconductorsubstrate 21, respectively.

The memory cell array 11, the first and second decoders/drivers 14 a and14 b, the potential generating circuit 15, the address buffer 16, thecontrol circuit 17, and the memory portion 18 correspond to the elementsshown in FIG. 6 and FIG. 18.

The memory cell array 11 has stacked sub-arrays M1, . . . M(n−1), and Mn(n is a natural number which is not smaller than 2). Each of thesub-arrays M1, . . . M(n−1), and Mn has first conductive lines (e.g.,word lines) and second conductive lines (e.g., bit lines) that crosseach other.

It is to be noted that each sub-array may have the first conductivelines and the second conductive lines, or the two sub-arrays which areadjacent to each other in a third direction (an up-and-down direction)may have either the first conductive lines or the second conductivelines in common.

When the first and second technological concepts are applied to thethree-dimensional cross-point type resistance change memory, a memorycapacity can be increased, and a sneak current that is produced in thethree-dimensional cross-point type can be effectively avoided, therebyavoiding erroneous writing and realizing low-consumption power.

8. CONCLUSION

Thus, according to the embodiments, in the operation mode that a voltageor a current is applied to a selected memory cell, suppressing leakcurrents flowing through unselected memory cells enables efficientlyapplying a voltage to a selected memory cell, thereby suppressing aconsumption current.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A resistance change memory comprising: firstconductive layers extending in a first direction, and arranged in asecond direction intersect with the first direction; second conductivelayers extending in the second direction, and arranged in the firstdirection; memory cells between the first conductive lines and thesecond conductive lines; a first driver/decoder connected to first endsof the first conductive lines; a second driver/decoder connected tofirst ends of the second conductive lines; a potential generatingcircuit generating a potential which is applied to the first ends of thefirst conductive lines and the first ends of the second conductivelines; and a control circuit controlling a operation mode which appliesa voltage or a current to a selected memory cell among the memory cells,wherein each of the memory cells comprises a rectifying element and aresistance change element connected in series, and the control circuitis configured, in the operation mode, to: apply a first potential to afirst end of a selected first conductive line connected to the selectedmemory cell among the first conductive lines and first ends ofunselected second conductive lines not connected to the selected memorycell among the second conductive lines, apply a second potential largerthan the first potential to a first end of a selected second conductiveline connected to the selected memory cell among the second conductivelines, apply third potentials smaller than the second potential to firstends of unselected first conductive lines not connected to the selectedmemory cell among the first conductive lines respectively, and changevalues of the third potentials based on an address of the selected firstconductive line.
 2. The memory of claim 1, wherein the third potentialsare equal to or higher than the potential of the selected secondconductive line at the position of the selected memory cell.
 3. Thememory of claim 1, wherein the third potentials applied to the firstends of the unselected first conductive lines placed on the oppositeside of the second decoder/driver side of the selected memory cell havethe same value.
 4. The memory of claim 3, wherein the value of the thirdpotentials applied to the first ends of the unselected first conductivelines placed on the opposite side of the second decoder/driver side ofthe selected memory cell is lowered in accordance with an increment inthe address of the selected first conductive line.
 5. The memory ofclaim 3, wherein the first conductive lines are divided into blocks, andthe value of the third potentials applied to the first ends of theunselected first conductive lines placed on the opposite side of thesecond decoder/driver side of the selected memory cell varies inaccordance with the block including the selected memory cell.
 6. Thememory of claim 1, wherein the third potentials applied to the firstends of the unselected first conductive lines placed on the seconddecoder/driver side of the selected memory cell have values that differdepending on each of the unselected first conductive lines.
 7. Thememory of claim 1, wherein the third potentials applied to the firstends of the unselected first conductive lines placed on the seconddecoder/driver side of the selected memory cell have the same value. 8.The memory of claim 7, wherein the first conductive lines are dividedinto blocks, and the value of the third potentials applied to the firstends of the unselected first conductive lines placed on the seconddecoder/driver side of the selected memory cell varies in accordancewith the block including the selected memory cell.
 9. The memory ofclaim 1, wherein the first conductive lines are divided into blocks, andthe third potentials applied to the first ends of the unselected firstconductive lines placed on the second decoder/driver side of theselected memory cell have values that differ in accordance with each ofthe blocks.
 10. The memory of claim 1, further comprising: a memoryportion which stores a relationship between the address of the selectedmemory cell and values of the third potentials applied to the first endsof the unselected first conductive lines, wherein the control circuitdetermines the values of the third potentials applied to the first endsof the unselected first conductive lines based on the address of theselected memory cell in the operation mode.
 11. A resistance changememory comprising: first conductive layers extending in a firstdirection, and arranged in a second direction intersect with the firstdirection; second conductive layers extending in the second direction,and arranged in the first direction; memory cells between the firstconductive lines and the second conductive lines; a first driver/decoderconnected to first ends of the first conductive lines; a seconddriver/decoder connected to first ends of the second conductive lines; apotential generating circuit generating a potential which is applied tothe first ends of the first conductive lines and the first ends of thesecond conductive lines; and a control circuit controlling a operationmode which applies a voltage or a current to a selected memory cellamong the memory cells, wherein each of the memory cells comprises arectifying element and a resistance change element connected in series,and the control circuit is configured, in the operation mode, to: applya first potential to a first end of a selected first conductive lineconnected to the selected memory cell among the first conductive lines,apply a second potential larger than the first potential to first endsof unselected first conductive lines not connected to the selectedmemory cell among the first conductive lines and a first end of aselected second conductive line connected to the selected memory cellamong the second conductive lines, apply third potentials larger thanthe first potential to first ends of unselected second conductive linesnot connected to the selected memory cell among the second conductivelines respectively, and change values of the third potentials based onan address of the selected second conductive line.
 12. The memory ofclaim 11, wherein the third potentials are equal to or higher than thepotential of the selected first conductive line at the position of theselected memory cell.
 13. The memory of claim 11, wherein the thirdpotentials applied to the first ends of the unselected second conductivelines placed on the opposite side of the first decoder/driver side ofthe selected memory cell have the same value.
 14. The memory of claim13, wherein the value of the third potentials applied to the first endsof the unselected second conductive lines placed on the opposite side ofthe first decoder/driver side of the selected memory cell is increasedin accordance with an increment in the address of the selected secondconductive line.
 15. The memory of claim 13, wherein the secondconductive lines are divided into blocks, and the value of the thirdpotentials applied to the first ends of the unselected second conductivelines placed on the opposite side of the first decoder/driver side ofthe selected memory cell varies in accordance with the block includingthe selected memory cell.
 16. The memory of claim 11, wherein the thirdpotentials applied to the first ends of the unselected second conductivelines placed on the first decoder/driver side of the selected memorycell have values that differ depending on each of the unselected secondconductive lines.
 17. The memory of claim 11, wherein the thirdpotentials applied to the first ends of the unselected second conductivelines placed on the first decoder/driver side of the selected memorycell have the same value.
 18. The memory of claim 17, wherein the secondconductive lines are divided into blocks, and the value of the thirdpotentials applied to the first ends of the unselected second conductivelines placed on the first decoder/driver side of the selected memorycell varies in accordance with the block including the selected memorycell.
 19. The memory of claim 11, wherein the second conductive linesare divided into blocks, and the third potentials applied to the firstends of the unselected second conductive lines placed on the firstdecoder/driver side of the selected memory cell have values that differin accordance with each of the blocks.
 20. The memory of claim 11,further comprising: a memory portion which stores a relationship betweenthe address of the selected memory cell and values of the thirdpotentials applied to the first ends of the unselected second conductivelines, wherein the control circuit determines the values of the thirdpotentials applied to the first ends of the unselected second conductivelines based on the address of the selected memory cell in the operationmode.
 21. The memory of claim 1, further comprising: a memory portionwhich stores a table showing a relationship between the address of theselected memory cell and values of the third potentials applied to thefirst ends of the unselected first conductive lines, wherein the controlcircuit determines the values of the third potentials applied to thefirst ends of the unselected first conductive lines based on the addressof the selected memory cell and the table in the operation mode.
 22. Thememory of claim 1, wherein the values of the third potentials applied tothe first ends of the unselected first conductive lines are determinedbased on an nth-order function (n is a natural number) by fitting arelationship between the address of the selected memory cell andadjustment values of the third potentials applied to the first ends ofthe unselected first conductive lines with respect to the nth-orderfunction.
 23. The memory of claim 1, wherein second ends on the oppositeside of the first ends of the first conductive lines and second ends onthe opposite side of the first ends of the second conductive lines areopened (an opened state).
 24. The memory of claim 1, wherein theoperation mode is a mode that one of a write operation and a readoperation of data relative to the selected memory cell is performed. 25.The memory of claim 1, further comprising: a semiconductor substrate;and memory cell arrays stacked on the semiconductor substrate, whereineach of the memory cell arrays comprises the first conductive lines, thesecond conductive lines, and the memory cells, and the firstdriver/decoder, the second driver/decoder, the potential generatingcircuit, and the control circuit are arranged on the semiconductorsubstrate.
 26. The memory of claim 11, further comprising: a memoryportion which stores a table showing a relationship between the addressof the selected memory cell and values of the third potentials appliedto the first ends of the unselected second conductive lines, wherein thecontrol circuit determines the values of the third potentials applied tothe first ends of the unselected second conductive lines based on theaddress of the selected memory cell and the table in the operation mode.27. The memory of claim 11, wherein the values of the third potentialsapplied to the first ends of the unselected second conductive lines aredetermined based on an nth-order function (n is a natural number) byfitting a relationship between the address of the selected memory celland adjustment values of the third potentials applied to the first endsof the unselected second conductive lines with respect to the nth-orderfunction.
 28. The memory of claim 11, wherein second ends on theopposite side of the first ends of the first conductive lines and secondends on the opposite side of the first ends of the second conductivelines are opened (an opened state).
 29. The memory of claim 11, whereinthe operation mode is a mode that one of a write operation and a readoperation of data relative to the selected memory cell is performed. 30.The memory of claim 11, further comprising: a semiconductor substrate;and memory cell arrays stacked on the semiconductor substrate, whereineach of the memory cell arrays comprises the first conductive lines, thesecond conductive lines, and the memory cells, and the firstdriver/decoder, the second driver/decoder, the potential generatingcircuit, and the control circuit are arranged on the semiconductorsubstrate.